All Micron Technology Inc Sponsors for H1B Applications - 2016

Explore H1B salary data for top companies like Micron-technology-inc across different cities for various job titles and discover the average salaries.

Company name
Job Title
City Name
Average Salary
Micron Technology Inc Hardware Engineer Boise $ 86,399 / Year
Micron Technology Inc Nve Ssd Validation Engineer Boise $ 75,000 / Year
Micron Technology Inc Nve Ssd Validation Engineer Boise $ 75,000 / Year
Micron Technology Inc Design Engineer Boise $ 120,217 / Year
Micron Technology Inc Cad Engineer Boise $ 79,783 / Year
Micron Technology Inc Design Verification Engineer Boise $ 93,408 / Year
Micron Technology Inc Emerging Memory Engineer Boise $ 103,401 / Year
Micron Technology Inc Design Engineer Boise $ 93,600 / Year
Micron Technology Inc Product Engineer Boise $ 77,000 / Year
Micron Technology Inc Product Engineer Boise $ 85,320 / Year
Micron Technology Inc Nand Design Rule Engineer Boise $ 85,500 / Year
Micron Technology Inc Deg Pe Engineer Boise $ 83,096 / Year
Micron Technology Inc Design Engineer Boise $ 93,600 / Year
Micron Technology Inc Rd Photolithography Engineer Boise $ 95,000 / Year
Micron Technology Inc Pqra Dram Development Engineer Quality Boise $ 83,096 / Year
Micron Technology Inc Tcad Device Engineer Boise $ 103,100 / Year
Micron Technology Inc Engineer Process Integrationrd Boise $ 94,000 / Year
Micron Technology Inc Design Engineer Boise $ 93,600 / Year
Micron Technology Inc Design Verification Engineer Boise $ 109,000 / Year
Micron Technology Inc Nand Engineer Boise $ 92,000 / Year

Last 5 Years H-1B Salary Data

h1bInfo.org is an independent website that displays public disclosure data in a user-friendly format. We have analyzed 10 years of H1B data from USCIS and the US Department of Labor, covering more than 6 million records from FY 2014 to FY 2023. However, for the latest and most accurate data, it's best to check the official sources directly. All content on H1BInfo is copyrighted and all rights are reserved from 2022 to 2023.